Electronic Board Level Underfill Material Market Size, Share, Demand & Trends by 2032
The global electronic board-level underfill material market is anticipated to witness opulent growth opportunities with a healthy CAGR of 5.3% between 2022 and 2032. The global market reached US$ 295.9 Mn in 2021 and is expected to touch a valuation of US$ 310.7 Mn in 2022.
In addition to that, the rise in production and
utilization of electronic products has led to the overall surge in the market
by expected a valuation surpassing US$ 520.7 Mn by the end of 2032. According
to the FMI historical analysis, the global electronic board level underfill
material market grew at a stagnant CAGR of 3.1% between 2015 and 2021.
Attributing to the surging usage of electronic devices
and the ongoing trend of miniaturization and development of multi-feature
electronic devices are some of the key factors expected to boost growth in the
global electronic board level underfill material market during the forecast
period.
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Underfill is mostly used to expand and redistribute
the thermo-mechanical stress associated with the Coefficient of Thermal
Expansion (CTE) mismatch between the silicon chip and organic substrate in
order to improve the reliability of a CSP, BGA, or flip chip on an organic
board package. A variety of substances are used for the manufacturing of these
underfills including epoxy, silica, alumina, silica gel, urethane, and many
others.
Key Takeaways
The electronic industry is one of the most dynamic
sectors of the economy and its significant rise has prompted major shifts in
funding. The integration of manufacturing networks combined with the
electronics sector has proven to be very beneficial to the ASEAN region since
they allow for improved commerce with bigger Asian economies like China.
China is a dominant and crucial country for the
development of the Asian electronic sector. China is known to acquire raw
materials and components from other Asian nations and then ship them all over
the globe. The rapid surge in the production of electronics will continue to
bolster growth in the global electronic board level underfill material market
during the forecast period.
The surging trend of miniaturization of electronic
devices led to a rise in the number of components on the printed circuit board.
Owing to this fast-growing trend, demand for smaller, thinner, and more highly
integrated printed circuit boards (PCBs) that are populated with the flip chip
is expected to rise.
Advanced nanotechnology and microelectromechanical
systems (MEMS) are rising in functionality along with the acceptance in a
majority of applications among various industries, such as consumer electronics
and others. The current pace of miniaturization of electronic devices will
result in a surge in demand for PCBs in near future.
Miniaturizing several electronic devices including
laptops, smartphones, consumer electronics, and many more, has led to an
increased usage of underfills materials in encapsulation and cavity filling
type applications, therefore elevating growth prospects for the global
electronic board level underfill material market.
Electronic Board Level Underfill materials offer
mechanical reinforcements to the solder joints and solder balls that join a
chip to a printed circuit board. Therefore, they play a key role in extending
the thermal aging and lifetime of electronic devices.
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Key Companies Profiled
- Henkel
AG & Co. KGaA
- Namics
Corporation
- ASE
Group
- MacDermid
Alpha Electronic Solutions
- Parker
LORD Corporation
- B.
Fuller Company
- Dow
Inc.
- ELANTAS
GmbH
- Zymet
- Hitachi
Chemical Co., Ltd.
- Panasonic
Corporation
- AI
Technology, Inc
- Indium
Corporation
- Sanyu
Rec Co., Ltd.
- Dymax
Corporation
- Epoxy
Technology, Inc.
- Protavic
International
- YINCAE
Advanced Materials, LLC
More Insights into the Electronic
Board Level Underfill Material Market
According to FMI analysis, the U.S. is projected to
account for a significant share of the global electronic board level underfill
material market by accounting for about 19.4% in 2022. The rapid growth in the
country is attributed to consumers’ high disposable income and per capita
expenditure.
Owing to the surging expansion of the electronic
industry and the presence of product types at a reasonable price point, the
electronic board level underfills material market in China is poised to grow at
a healthy pace of around 6.2% CAGR during the forecast period.
Electronic Board Level Underfill Material
Market by Category
By
Product Type:
- Underfills
- Capillary
- Edge
Bonds
- Gob
Top Encapsulations
By
Material Type:
- Quartz
/ Silicone
- Alumina
Based
- Epoxy
Based
- Urethane
Based
- Acrylic
Based
- Others
By
Board Type:
- CSP
(Chip Scale Package)
- BGA
(Ball Grid array)
- Flip
Chips
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